Calibration anchors

Public HJT process windows the twin's physics is tuned against

Cell-side performance

Metric	Industry window	Source	Notes
Cell efficiency η	23.5 – 24.7 %	Kaneka, LONGi HPBC, Meyer Burger, Maxeon	M10 production HJT, late 2024
Implied V_oc (iV_oc)	740 – 750 mV	Kaneka public PV Tech disclosures	Post-PECVD passivation
J₀	5 – 10 fA/cm²	ITRPV 2024	Post i-layer optimisation
Sheet resistance (TCO front)	30 – 80 Ω/□	ISFH / Helmholtz HZB	ITO/IWO 80–100 nm
Transmission (400-1100 nm avg)	> 85 %	TCO supplier datasheets	Critical for J_sc
Cell P_max (M10)	7.2 – 7.4 W	LONGi HPBC release	Nominal 7.3 W per cell used as twin baseline

Module-side performance

Metric	Industry window	Source	Notes
Module power (72-cell M10)	580 – 620 W	Tier-1 module datasheets	—
Cure α (lamination)	> 0.85	DuPont EVA application notes	Crosslink density target
Bubble defect rate	< 0.5 %	IEC 61215	Visual + EL screening
Microcrack rate (M10, MBB)	< 1 %	VDMA PV roadmap	—

Process windows

Metric	Industry window	Source	Notes
PECVD i-layer thickness	5 – 8 nm	Kaneka 2014 patent literature	Below 4 nm → epi growth
PECVD deposition T	180 – 220 °C	Meyer Burger SmartLine specs	Above 220 °C → H effusion
TCO O₂/(Ar+O₂)	1.5 – 2.5 %	ULVAC sputter manuals	—
Solder iron T	220 – 260 °C	Cell-to-ribbon process windows	—
Lamination plate T	148 – 155 °C	Bürkle / Meier press specs	—
Vacuum hold	240 – 480 s	DuPont EVA processing guide	—

RIL Defect Catalog Adopted (18 defects)

Optimon recognizes, attributes, and reasons about RIL's actual defect taxonomy. The 18 defects below drive the EL Gallery, the Quality Inspection page, the Bayesian Root-Cause hypothesis space, the fault injectors, and Ved's responses. Source for all entries: RIL FI Defect Specification (Choice column accepted).

Code	Name	Type	Surface	Tier rule
101	Crack cell (middle)	Cell Defect	EL	Not allowed in A/B; allowed in C if crack piece doesn't overlap
102	Crack cell (outside wire)	Cell Defect	EL	Not allowed in A/B; allowed in C if crack piece doesn't overlap
112	Crushed cell	Cell Defect	EL	Not allowed in any module → Scrap
129	Cell chip	Cell Defect	EL	A: ≤1×2 mm, max 1/cell, max 3 cells/module
106	Broken finger	Cell Defect	EL	A: ≤5 broken fingers, total gap ≤30 mm
108	Broad finger	Cell Defect	EL	A: width ≤0.5 mm
115	Incomplete deposition	Cell Defect	EL	Refer to contamination scheme
117	Cell flake	Cell Defect	EL	Refer to contamination scheme
151	String spacing	Cell Defect	EL	A: 0.5–4.5 mm
156	Uneven string	Cell Defect	EL	A: displacement ≤2.5 mm
198	Bubble (active)	Bubble Defect	EL	A: single ≤15 mm², total ≤25 mm²
199	Bubble (inactive)	Bubble Defect	EL	Refer to scheme
143	Glass bubble	Glass Defect	VISUAL	A: front/back W<0.5 mm, L≤1 mm, qty 3
635	Glass broken	Glass Defect	VISUAL	Not allowed in any module → Scrap
141	Glass scratch	Glass Defect	VISUAL	A: L<50 mm, W<1 mm, qty 1
402	Frame corner gap	Frame Defect	VISUAL	Reference scheme
414	Sealant discontinuous	Frame Sealant Defect	VISUAL	Reference scheme
906	Power output low	Power Output Defect	FLASH	Below recipe spec band

Honesty footer

Process Twin (HJT) is a physics-driven simulator built to demonstrate Optimon's industrial intelligence approach for HJT solar manufacturing. Models are calibrated to the public HJT process windows above (Kaneka, LONGi, Meyer Burger, Maxeon, ITRPV, IEC 61215, VDMA) and tuned for operational reasoning — they are not certified to any specific OEM tool. All telemetry is generated by the on-board physics simulator. Live PLC/SCADA/MES ingest is wired but not enabled in this build. State is in-memory; persistence via Lovable Cloud is wired and can be enabled. EL imaging is procedurally generated with a defect signature library; production deployment integrates with EyeZ, Optimon's machine vision module.